We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bonding Plating.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

Bonding Plating - List of Manufacturers, Suppliers, Companies and Products

Bonding Plating Product List

1~2 item / All 2 items

Displayed results

The Role of Plating: Functional Plating - Joint Plating

Introducing "functional plating," which adds functionality and is one of the advantages of plating!

The bonding function is commonly used in electronic and electrical devices. When it comes to bonding, some of you may have the image of pulling out solder in a reel and using a soldering iron to melt the solder and attach components. Plating is a metallic film, and the properties vary depending on the metal used. On our company website, we introduce "functional plating," which is one of the advantages of plating that utilizes the properties of the metal to impart functionality. For more details, please refer to the related links below. [Content Included] ■ "Bonding" plating that connects metals together *For more details, please refer to the PDF materials or feel free to contact us.

  • Other metal materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Joint plating

Introducing Mitsuya's recommended joining coatings!

■Gold-Tin Alloy Plating Gold-tin alloy plating, composed of 80% gold and 20% tin eutectic, is the optimal alloy plating for high-temperature lead-free solder materials with a melting point of 280°C. ■Tin-Antimony Alloy Plating Compared to regular tin plating, it excels in preventing tin pest and has superior heat cycle durability. ■Indium Plating Indium has a very soft, dull white appearance and is prone to scratching. Its hardness is below Hv5, and its melting point is 156.6°C. It has also proven effective in preventing contact failure as a joining tool for bundling similar vessels.

  • Wafer
  • Sensors
  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration